Superconductivity Fabrication Equipment
Niobium trilayer sputtering system
ECR CVD system for SiO2 insulation
10:1 Projection printer for lithography
Pd resistor and contact pad evaporator
Reactive ion etching system
Other Key Equipment
1:1 contact printer
Back-up capability for some fabrication systems
Pattern generation for masks
Dicing saw and wire bonder
Flip-chip bump-bonding facility
Profilimeter,ellipsometer, SEM, AFM, flatguage, various other analytical tools
Home: The UC Berkeley
cryoelectronics home page